Mechanical Standardization of Semiconductor Devices. General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages. Design Guide for Stacked Packages. Fine-Pitch Ball Grid Array and Fine-Pitch Land Grid Array

Semiconductor devices, Electronic equipment and components, Standardization, Drawings, Engineering drawings, Technical drawing, Packages, Dimensions, Interchangeability, Surface mounting devices, Integrated circuits, Designations, Design