Advanced Flip Chip Packaging

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Advanced Flip Chip Packaging

Advanced Flip Chip Packaging

Name: Advanced Flip Chip Packaging
ISBN: 9781441957689

Robert Lanzone (auth.), Ho-Ming Tong, Yi-Shao Lai, C.P. Wong (eds.)

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Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

种类:

Engineering

年:

2013

出版:

出版社:

Springer US

语言:

english

页:

560

ISBN 10: